Invention Grant
- Patent Title: Combination of a substrate and a wafer
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Application No.: US13915908Application Date: 2013-06-12
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Publication No.: US08664082B2Publication Date: 2014-03-04
- Inventor: Erich Thallner
- Applicant: Erich Thallner
- Agency: Kusner & Jaffe
- Priority: DE102006000687 20060103
- Main IPC: H01L21/30
- IPC: H01L21/30
Abstract:
The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer.
Public/Granted literature
- US20130295746A1 COMBINATION OF A SUBSTRATE AND A WAFER Public/Granted day:2013-11-07
Information query
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