Invention Grant
US08664517B2 Solar cell assembly with combined handle substrate and bypass diode and method 有权
具有组合手柄基板和旁路二极管的太阳能电池组件及方法

  • Patent Title: Solar cell assembly with combined handle substrate and bypass diode and method
  • Patent Title (中): 具有组合手柄基板和旁路二极管的太阳能电池组件及方法
  • Application No.: US13606002
    Application Date: 2012-09-06
  • Publication No.: US08664517B2
    Publication Date: 2014-03-04
  • Inventor: Jerry R. Kukulka
  • Applicant: Jerry R. Kukulka
  • Applicant Address: US IL Chicago
  • Assignee: The Boeing Company
  • Current Assignee: The Boeing Company
  • Current Assignee Address: US IL Chicago
  • Main IPC: H01L31/00
  • IPC: H01L31/00 H01L21/00
Solar cell assembly with combined handle substrate and bypass diode and method
Abstract:
A solar cell assembly and method are disclosed. The solar cell assembly comprises a substrate having a front surface and a back surface, wherein the substrate has a p-n junction providing reverse bias protection, and wherein the substrate functions as a bypass diode. The solar cell assembly further comprises a multijunction solar cell having a plurality of solar cell layers, wherein the multijunction solar cell has a first surface and a second surface, the first surface being attached to the front surface of the substrate. The solar cell assembly further comprises an electrical connector element positioned adjacent the front surface of the substrate and the first surface of the multijunction solar cell, a first contact coupled to the back surface of the substrate, and at least one second contact coupled to a portion of the second surface of the multijunction solar cell.
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