Invention Grant
- Patent Title: Wired circuit board
- Patent Title (中): 有线电路板
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Application No.: US12285837Application Date: 2008-10-15
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Publication No.: US08664535B2Publication Date: 2014-03-04
- Inventor: Katsutoshi Kamei , Tetsuya Ohsawa , Voon Yee Ho
- Applicant: Katsutoshi Kamei , Tetsuya Ohsawa , Voon Yee Ho
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards
- Priority: JP2007-268292 20071015
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03
Abstract:
A wired circuit board includes a first insulating layer, a first wire formed on the first insulating layer, a second insulating layer formed on the first insulating layer so as to cover the first wire, and a second wire placed opposite to the first wire in a thickness direction and formed in a smaller width than that of the first wire.
Public/Granted literature
- US20090098745A1 Wired circuit board Public/Granted day:2009-04-16
Information query
