The present invention relates to a terminal-integrated package method for a metal base package module that can effectively prevent short-circuit or breakage by not using wire bonding for connection with an external circuit.The terminal-integrated package method for the metal base package module includes: preparing a metal substrate formed with a conductive metal material; forming an oxide layer by oxidizing one side of the metal substrate to a predetermined depth; forming an insulation groove by partially eliminating the metal substrate to the oxide layer with a constant width along the circumference of the metal substrate from an opposite side of the metal substrate; forming a plurality of external connection terminals by forming a separation groove by eliminating a circumference portion of the metal substrate, disconnected with a center portion thereof by the insulation groove along the circumference with a predetermined gap; mounting or manufacturing an electronic part on the metal substrate or the oxide layer; and electrically connecting an electrode of the electronic part with the external connection terminal.