Invention Grant
- Patent Title: Insulative wire-clipping bushing
- Patent Title (中): 绝缘线夹
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Application No.: US13331186Application Date: 2011-12-20
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Publication No.: US08664543B2Publication Date: 2014-03-04
- Inventor: Bi-Ju Chen
- Applicant: Bi-Ju Chen
- Applicant Address: TW Taipei
- Assignee: Best Exclusive Holdings Limited
- Current Assignee: Best Exclusive Holdings Limited
- Current Assignee Address: TW Taipei
- Agent Leong C. Lei
- Main IPC: H02G3/18
- IPC: H02G3/18

Abstract:
An insulative wire-clipping bushing includes a main body, support frames and a pair of clip bodies. The main body has a first surface and a second surface, and the support frames are installed and extended from symmetric edges of the first surface, and ends of the support frames are bent inwardly to form a half-hood structure, and the pair of clip bodies are installed and extended from the first surface and disposed between the support frames, and the pair of clip bodies are installed symmetrically, and ends of the pair of clip bodies are bent inwardly to form a tapered hook structure, and a wiring space is formed between the ends of the clip bodies, so that the bushing can be passed into a through hole of an electricity distribution box to pass and install at least one wire and provide a clipping force required for clamping the wire.
Public/Granted literature
- US20130153265A1 INSULATIVE WIRE-CLIPPING BUSHING Public/Granted day:2013-06-20
Information query
IPC分类: