Invention Grant
US08664693B2 Light emitting diode having algan buffer layer and method of fabricating the same
有权
具有阴离子缓冲层的发光二极管及其制造方法
- Patent Title: Light emitting diode having algan buffer layer and method of fabricating the same
- Patent Title (中): 具有阴离子缓冲层的发光二极管及其制造方法
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Application No.: US12090047Application Date: 2007-03-09
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Publication No.: US08664693B2Publication Date: 2014-03-04
- Inventor: Ki Bum Nam
- Applicant: Ki Bum Nam
- Applicant Address: KR Ansan-si
- Assignee: Seoul Opto Device Co., Ltd.
- Current Assignee: Seoul Opto Device Co., Ltd.
- Current Assignee Address: KR Ansan-si
- Agency: H.C. Park & Associates, PLC
- Priority: KR10-2006-0023196 20060313
- International Application: PCT/KR2007/001171 WO 20070309
- International Announcement: WO2007/105882 WO 20070920
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
The present invention relates to a light emitting diode having an AlxGa1-xN buffer layer and a method of fabricating the same, and more particularly, to a light emitting diode having an AlxGa1-xN buffer layer, wherein between a substrate and a GaN-based semiconductor layer, the Al x Ga 1-x N (O≦x≦1) buffer layer having the composition ratio x of Al decreasing from the substrate to the GaN-based semiconductor layer is interposed to reduce lattice mismatch between the substrate and the GaN-based semiconductor layer, and a method of fabricating the same. To this end, the present invention provides a light emitting diode comprising a substrate; a first conductive semiconductor layer positioned on the substrate; and an AlxGa1-xN (O≦x≦1) buffer layer interposed between the substrate and the first conductive semiconductor layer and having a composition ratio x of Al decreasing from the substrate to the first conductive semiconductor layer.
Public/Granted literature
- US20090032833A1 LIGHT EMITTING DIODE HAVING ALGAN BUFFER LAYER AND METHOD OF FABRICATING THE SAME Public/Granted day:2009-02-05
Information query
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