Invention Grant
- Patent Title: Methods and apparatus for reduced gate resistance finFET
- Patent Title (中): 降低栅极电阻finFET的方法和装置
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Application No.: US13325922Application Date: 2011-12-14
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Publication No.: US08664729B2Publication Date: 2014-03-04
- Inventor: Chewn-Pu Jou , Tzu-Jin Yeh , Hsieh-Hung Hsieh
- Applicant: Chewn-Pu Jou , Tzu-Jin Yeh , Hsieh-Hung Hsieh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L27/088
- IPC: H01L27/088

Abstract:
Methods and apparatus for reduced gate resistance finFET. A metal gate transistor structure is disclosed including a plurality of semiconductor fins formed over a semiconductor substrate, the fins being arranged in parallel and spaced apart; a metal containing gate electrode formed over the semiconductor substrate and overlying a channel gate region of each of the semiconductor fins, and extending over the semiconductor substrate between the semiconductor fins; an interlevel dielectric layer overlying the gate electrode and the semiconductor substrate; and a plurality of contacts disposed in the interlevel dielectric layer and extending through the interlevel dielectric layer to the gate electrode; a low resistance metal strap formed over the interlevel dielectric layer and coupled to the gate electrode by the plurality of contacts; wherein the plurality of contacts are spaced apart from the channel gate regions of the semiconductor fins. Methods for forming the reduced gate finFET are disclosed.
Public/Granted literature
- US20130154011A1 Methods and Apparatus for Reduced Gate Resistance FinFET Public/Granted day:2013-06-20
Information query
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