Invention Grant
- Patent Title: Strengthened micro-electromechanical system devices and methods of making thereof
- Patent Title (中): 加强微机电系统装置及其制造方法
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Application No.: US13027199Application Date: 2011-02-14
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Publication No.: US08664731B2Publication Date: 2014-03-04
- Inventor: Charles W. Blackmer , Scott G. Adams , Andrew S. Hocking , Kristin J. Lynch , Ashish A. Shah
- Applicant: Charles W. Blackmer , Scott G. Adams , Andrew S. Hocking , Kristin J. Lynch , Ashish A. Shah
- Applicant Address: US NY Ithaca
- Assignee: Kionix, Inc.
- Current Assignee: Kionix, Inc.
- Current Assignee Address: US NY Ithaca
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L29/84
- IPC: H01L29/84
Abstract:
In an embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam, and can have a non-linear shape. In another embodiment, a micro-electromechanical device can include a substrate, a beam, and an isolation joint. The beam can be suspended relative to a surface of the substrate. The isolation joint can be between a first portion and a second portion of the beam. The isolation joint can have a first portion, a second portion, and a bridge portion between the first portion and the second portion. The first and second portions of the isolation joint can each have a seam and a void, while the bridge portion can be solid.
Public/Granted literature
- US20120205752A1 Strengthened Micro-Electromechanical System Devices and Methods of Making Thereof Public/Granted day:2012-08-16
Information query
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