Invention Grant
- Patent Title: Integrated inductor
- Patent Title (中): 集成电感
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Application No.: US13187403Application Date: 2011-07-20
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Publication No.: US08664745B2Publication Date: 2014-03-04
- Inventor: Ross Teggatz , Wayne Chen , Brett Smith
- Applicant: Ross Teggatz , Wayne Chen , Brett Smith
- Applicant Address: US TX Richardson
- Assignee: Triune IP LLC
- Current Assignee: Triune IP LLC
- Current Assignee Address: US TX Richardson
- Agency: Hovey Williams LLP
- Main IPC: H01L23/14
- IPC: H01L23/14 ; H01L23/29 ; H01L23/495
Abstract:
The invention provides advances in the arts with useful and novel integrated packaging having inductor elements and adjacent magnetic material enhancing the inductance characteristics of the packaged inductor. Preferably the integrated packages also contain one or more ICs operable coupled to the inductor(s).
Public/Granted literature
- US20120038025A1 INTEGRATED INDUCTOR Public/Granted day:2012-02-16
Information query
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