Invention Grant
US08664771B2 Apparatuses and methods to enhance passivation and ILD reliability
有权
增强钝化和ILD可靠性的设备和方法
- Patent Title: Apparatuses and methods to enhance passivation and ILD reliability
- Patent Title (中): 增强钝化和ILD可靠性的设备和方法
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Application No.: US13493693Application Date: 2012-06-11
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Publication No.: US08664771B2Publication Date: 2014-03-04
- Inventor: Richard J. Harries , Sudarashan V. Rangaraj , Bob Sankman
- Applicant: Richard J. Harries , Sudarashan V. Rangaraj , Bob Sankman
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman, Lundberg & Woessner, P.A.
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
Some embodiments of the present invention include apparatuses and methods relating to processing and packaging microelectronic devices that reduce stresses on and limit or eliminate crack propagation in the devices.
Public/Granted literature
- US20120241952A1 APPARATUSES AND METHODS TO ENHANCE PASSIVATION AND ILD RELIABILITY Public/Granted day:2012-09-27
Information query
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