Invention Grant
- Patent Title: Linear motor coil assembly with cooling device
- Patent Title (中): 线性电机线圈组件带冷却装置
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Application No.: US13124358Application Date: 2009-10-23
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Publication No.: US08664808B2Publication Date: 2014-03-04
- Inventor: Hiroshi Koshimoto , Satoru Tajima
- Applicant: Hiroshi Koshimoto , Satoru Tajima
- Applicant Address: JP Kanagawa
- Assignee: Sodick Co., Ltd.
- Current Assignee: Sodick Co., Ltd.
- Current Assignee Address: JP Kanagawa
- Agency: J.C. Patents
- Priority: JP2008-273258 20081023
- International Application: PCT/JP2009/005604 WO 20091023
- International Announcement: WO2010/047129 WO 20100429
- Main IPC: H02K9/19
- IPC: H02K9/19 ; H02K41/02

Abstract:
A linear motor coil assembly includes a base plate (1), a line of iron cores affixed longitudinally on the upper surface of the base plate, multiple coils respectively provided for the iron cores, and a first cooling tube being in contact with contacts the multiple coils and through which a first refrigerant passes. The lower surface of the base plate can be attached to a precision table of a machine tool or a semiconductor manufacturing apparatus. A groove (8) that extends longitudinally in linear fashion is formed on the lower surface of the base plate. A second cooling tube (92, 94), through which a second refrigerant passes, provided within the groove is additionally provided in the linear motor coil assembly.
Public/Granted literature
- US20110198946A1 LINEAR MOTOR COIL ASSEMBLY WITH COOLING DEVICE Public/Granted day:2011-08-18
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