Invention Grant
US08664946B2 Sensor packages including a lead frame and moulding body and methods of manufacturing
有权
包括引线框架和成型体以及制造方法的传感器封装
- Patent Title: Sensor packages including a lead frame and moulding body and methods of manufacturing
- Patent Title (中): 包括引线框架和成型体以及制造方法的传感器封装
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Application No.: US12526833Application Date: 2008-02-13
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Publication No.: US08664946B2Publication Date: 2014-03-04
- Inventor: Paulus Martinus Catharina Hesen , Roelf Anco Jacob Groenhuis , Johannes Wilhelmus Dorotheus Bosch
- Applicant: Paulus Martinus Catharina Hesen , Roelf Anco Jacob Groenhuis , Johannes Wilhelmus Dorotheus Bosch
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP07003414 20070219
- International Application: PCT/IB2008/050510 WO 20080213
- International Announcement: WO2008/102281 WO 20080828
- Main IPC: G01R33/09
- IPC: G01R33/09
Abstract:
In one embodiment, a sensor package includes a lead frame with a first portion extending and a second portion extending in a direction inclined with respect to the first potion. The sensor package also includes an application specific integrated circuit and a magneto resistive sensor and a ferrite provided with a molding body.
Public/Granted literature
- US20100117171A1 SENSOR PACKAGE Public/Granted day:2010-05-13
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