A system for inspecting bonding resistance of a display device includes a display panel, at least one circuit board, at least one driving chip and a testing board. The display panel includes at least one testing conductive line and connecting conductive lines. The circuit board is connected with the testing conductive line and the connecting conductive lines. The driving chip includes at least one testing pad and connecting pads, respectively electrically connected to the testing conductive line and the connecting conductive lines; at least one comparator connected to the testing pad; and at least one logic circuit connected to the comparator. The testing board is connected to the circuit board and provides a test signal to the testing pad through the circuit board and the testing conductive line. The test signal is compared with a reference signal in the comparator, and the logic circuit determines a comparing result.