Invention Grant
- Patent Title: Integrated microminiature relay
- Patent Title (中): 集成微型继电器
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Application No.: US12725168Application Date: 2010-03-16
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Publication No.: US08665041B2Publication Date: 2014-03-04
- Inventor: Todd Richard Christenson
- Applicant: Todd Richard Christenson
- Applicant Address: US NM Albuquerque US RI Warwick
- Assignee: HT MicroAnalytical, Inc.,COTO Technology, Inc.
- Current Assignee: HT MicroAnalytical, Inc.,COTO Technology, Inc.
- Current Assignee Address: US NM Albuquerque US RI Warwick
- Agency: Kaplan Breyer Schwarz & Ottesen, LLP
- Main IPC: H01H51/22
- IPC: H01H51/22

Abstract:
A micro-relay that overcomes some of the limitations and drawbacks of the prior art is disclosed. The micro-relay comprising: (1) a first substrate comprising one or more monolithically integrated planar coils for generating a magnetic field; and (2) a second substrate comprising a magnetically actuated switch having a moving contact that selectively moves in a plane parallel to its substrate. The first and second substrate are aligned and bonded to collectively provide a closed magnetic circuit that efficiently channels the generated magnetic field through the switch.
Public/Granted literature
- US20100171577A1 Integrated Microminiature Relay Public/Granted day:2010-07-08
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