Invention Grant
- Patent Title: Semiconductor component with coreless transformer
- Patent Title (中): 具有无芯变压器的半导体元件
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Application No.: US13452075Application Date: 2012-04-20
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Publication No.: US08665054B2Publication Date: 2014-03-04
- Inventor: Matthias Stecher , Markus Menath , Andreas Zankl , Werner Robl
- Applicant: Matthias Stecher , Markus Menath , Andreas Zankl , Werner Robl
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01L27/08

Abstract:
A semiconductor component has integrated a coreless transformer with a first connection contact, a second connection contact, an electrically conductive spiral first coil, an electrically conductive first ring, and an electrically conductive second ring. The electrically conductive spiral first coil is electrically connected between the first connection contact and the second connection contact. The electrically conductive first ring surrounds the first coil and one or both of the first connection contact and the second connection contact. The electrically conductive second ring is arranged between the first coil and the first ring, electrically connected to the first coil, and surrounds the first coil and one or both of the first connection contact and the second connection contact.
Public/Granted literature
- US20130278372A1 Semiconductor Component with Coreless Transformer Public/Granted day:2013-10-24
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