Invention Grant
- Patent Title: Systems and methods to thermally manage electronic devices
- Patent Title (中): 用于热管理电子设备的系统和方法
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Application No.: US12974512Application Date: 2010-12-21
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Publication No.: US08665591B2Publication Date: 2014-03-04
- Inventor: Richard Bourgeois , Kristopher Frutschy , Mohamed Sakami , William Waters , Mao Leng
- Applicant: Richard Bourgeois , Kristopher Frutschy , Mohamed Sakami , William Waters , Mao Leng
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: GE Global Patent Operation
- Agent John A. Kramer
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A system for an electronic device includes a housing having one or more walls that define an internal region. An outlet port is fluidically coupled to the internal region of the housing, which allows emission of a fluid from the internal region of the housing as a first flow at a first temperature. A merging element, fluidically coupled to the outlet port, merges the first flow with a second flow, which has a second temperature that is less than the first temperature.
Public/Granted literature
- US20120155025A1 SYSTEMS AND METHODS TO THERMALLY MANAGE ELECTRONIC DEVICES Public/Granted day:2012-06-21
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