A housing for electrical components is provided. The housing may include a mouth portion to cooperate with a circuit board in an assembled condition wherein said circuit board is applied against said mouth portion of the housing. The housing may include at least one spring formation located at said mouth portion to cooperate with said circuit board to elastically urge said circuit board away from said mouth portion, and at least one hook-like formation extending from said mouth portion distally of said housing, said hook-like formation adapted to cooperate with said circuit board to retain said circuit board assembled to said housing against the force exerted by said spring formation.