Invention Grant
- Patent Title: Circuit board packaging structure
- Patent Title (中): 电路板封装结构
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Application No.: US13071305Application Date: 2011-03-24
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Publication No.: US08665608B2Publication Date: 2014-03-04
- Inventor: Yoshito Hayashi , Masakatsu Tanji
- Applicant: Yoshito Hayashi , Masakatsu Tanji
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Foley & Lardner LLP
- Priority: JP2010-120124 20100526
- Main IPC: H05K7/14
- IPC: H05K7/14 ; H05K7/18

Abstract:
The circuit board packaging structure capable of inserting and extracting an interface part of a circuit board into and from a connector part of the processing equipment in a direction different from a direction of attaching and detaching the circuit board to and from the processing equipment includes: an operating part which turns on receiving force; a plate part which is fixed to the circuit board to be rotatable in a direction reverse to a turning direction of the operating part, and converts the force received by the operating part to force in a direction different from the attaching and detaching direction to move the circuit board in that direction; a link part which connects the operating part with the plate part to transmit the force received by the operating part to the plate part; and a fastener which fastens the circuit board and the operating part with play.
Public/Granted literature
- US20110292620A1 CIRCUIT BOARD PACKAGING STRUCTURE Public/Granted day:2011-12-01
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