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US08667251B2 Electronic chip and integrated circuit including a split routing unit having first-level routers for intra-layer transmissions and second-level routers for inter-layer transmissions and transmissions to the processing units 有权
电子芯片和集成电路包括具有用于层内传输的第一级路由器和用于层间传输的第二层路由器的分离路由单元和到处理单元的传输

Electronic chip and integrated circuit including a split routing unit having first-level routers for intra-layer transmissions and second-level routers for inter-layer transmissions and transmissions to the processing units
Abstract:
This electronic chip includes functional modules each including a single processing unit and a single routing unit (110E) connected to one another, and connections, called routing connections, each of which has at least one end connected to the routing unit of a functional module, where the routing connections connect between themselves the routing units of the functional modules so as to allow routing of data between the processing units of the functional modules.The routing unit (110E) of at least one functional module, called a split routing unit, includes two routers (112E, 114E), called respectively a first-level router and a second-level router, which are connected to one another, where the first-level router is moreover connected to at least two routing connections, and where the second-level router is moreover connected to the processing unit of this functional module and connected to at least one other routing connection.
Abstract(Chinese):

该电子芯片包括功能模块，每个功能模块包括单个处理单元和彼此连接的单个路由单元（110E），以及称为路由连接的连接，每个路由连接至少一端连接到功能模块的路由单元， 其中路由连接在它们之间连接功能模块的路由单元，以便允许在功能模块的处理单元之间路由数据。 被称为分离路由单元的至少一个功能模块的路由单元（110E）包括分别被称为彼此连接的第一级路由器和第二级路由器的两个路由器（112E，114E），其中 此外，第一级路由器还连接至少两路由连接，并且其中第二级路由器还连接到该功能模块的处理单元并连接到至少一个其他路由连接。

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