Invention Grant
- Patent Title: Concurrent placement and routing using hierarchical constraints
- Patent Title (中): 使用层次约束并发放置和布线
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Application No.: US13399803Application Date: 2012-02-17
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Publication No.: US08667444B2Publication Date: 2014-03-04
- Inventor: Lindor E. Henrickson , Lyndon C. Lim
- Applicant: Lindor E. Henrickson , Lyndon C. Lim
- Applicant Address: US CA Mountain View
- Assignee: Synopsys, Inc.
- Current Assignee: Synopsys, Inc.
- Current Assignee Address: US CA Mountain View
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Agent Judith A. Szepesi
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
An automated layout method allows designing advanced integrated circuits with design rules of high complexity. In particular, a hierarchical constrained layout process is applicable and useful for analog and mixed-signal integrated circuit designs and may be based on an incremental concurrent placement and routing. Use of constraints from multiple levels of a circuit description hierarchy allows computationally efficient processing of logical circuit increments and produces high-quality outcomes. Users such as circuit designers can exercise a high degree of predictability and control over the resulting physical layout construction by either user-specified or computer-generated constraints.
Public/Granted literature
- US20130219353A1 CONCURRENT PLACEMENT AND ROUTING USING HIERARCHICAL CONSTRAINTS Public/Granted day:2013-08-22
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