Invention Grant
- Patent Title: Method for manufacturing a polycrystalline dielectric layer
- Patent Title (中): 多晶电介质层的制造方法
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Application No.: US13338766Application Date: 2011-12-28
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Publication No.: US08667654B2Publication Date: 2014-03-11
- Inventor: Mickael Gros-Jean
- Applicant: Mickael Gros-Jean
- Applicant Address: unknown Crolles
- Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: unknown Crolles
- Agency: Seed IP Law Group PLLC
- Priority: FR1061348 20101229
- Main IPC: H01G7/00
- IPC: H01G7/00

Abstract:
A method manufactures a capacitor having polycrystalline dielectric layer between two metallic electrodes. The dielectric layer is formed by a polycrystalline growth of a dielectric metallic oxide on one of the metallic electrodes. At least one polycrystalline growth condition of the dielectric oxide is modified during the formation of the polycrystalline dielectric layer, which results in a variation of the polycrystalline properties of the dielectric oxide within the thickness of said layer.
Public/Granted literature
- US20120170170A1 METHOD FOR MANUFACTURING A POLYCRYSTALLINE DIELECTRIC LAYER Public/Granted day:2012-07-05
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