Invention Grant
- Patent Title: Electronic component mounting apparatus
- Patent Title (中): 电子元件安装装置
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Application No.: US13430277Application Date: 2012-03-26
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Publication No.: US08667670B2Publication Date: 2014-03-11
- Inventor: Keisuke Ishida
- Applicant: Keisuke Ishida
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sony Corporation
- Priority: JP2011-079858 20110331
- Main IPC: B23P19/00
- IPC: B23P19/00

Abstract:
A mounting apparatus includes a first placing unit and a second placing unit each configured to thrust an electronic component that is held toward a substrate, place the electronic component on the substrate, and leave the substrate, and a controller configured to set an inhibit period during which, while one placing unit of the first placing unit and the second placing unit thrusts the electronic component or leaves the substrate, at least one of a thrusting operation of the electronic component and an operation of leaving the substrate by another placing unit is inhibited so that the other placing unit does not execute the at least one of the thrusting operation and the operation of leaving the substrate.
Public/Granted literature
- US20120246928A1 MOUNTING APPARATUS, ELECTRONIC COMPONENT PLACEMENT METHOD, AND SUBSTRATE MANUFACTURING METHOD Public/Granted day:2012-10-04
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