Invention Grant
- Patent Title: Sensor assemblies and methods of assembling same
- Patent Title (中): 传感器组件及组装方法
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Application No.: US13112187Application Date: 2011-05-20
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Publication No.: US08667856B2Publication Date: 2014-03-11
- Inventor: Jacob John Kittleson , Shankar Chandrasekaran , Munish Vishwas Inamdar
- Applicant: Jacob John Kittleson , Shankar Chandrasekaran , Munish Vishwas Inamdar
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Armstrong Teasdale LLP
- Main IPC: G01D21/00
- IPC: G01D21/00 ; G01D7/02 ; B25B11/00

Abstract:
A method for assembling a sensor assembly includes providing a sensing device configured to measure at least one variable. The method also includes at least partially enclosing a magnetic material within an enclosure. At least a portion of the enclosure is manufactured from a material having a permeability that facilitates forming a magnetic field therein. The method also includes coupling the sensing device to a first portion of the enclosure. The enclosure includes at least one second portion that is movable with respect to the first portion of the enclosure such that a magnetic coupling force is induced external to the enclosure to facilitate coupling the sensor assembly to a magnetic surface.
Public/Granted literature
- US20120291570A1 SENSOR ASSEMBLIES AND METHODS OF ASSEMBLING SAME Public/Granted day:2012-11-22
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