Invention Grant
- Patent Title: Two-phase packaging of ready mix joint compound
- Patent Title (中): 预拌混合料两相包装
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Application No.: US13335272Application Date: 2011-12-22
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Publication No.: US08668087B2Publication Date: 2014-03-11
- Inventor: Pamela L. Hargrove , Richard B. Stevens
- Applicant: Pamela L. Hargrove , Richard B. Stevens
- Applicant Address: US IL Chicago
- Assignee: United States Gypsum Company
- Current Assignee: United States Gypsum Company
- Current Assignee Address: US IL Chicago
- Agency: Greer, Burns & Crain, Ltd.
- Agent Pradip Sahu; Philip T. Petti
- Main IPC: B65D85/84
- IPC: B65D85/84

Abstract:
A wallboard joint compound package is provided, including a container defining an interior space and configured for being sealed, a first component of ready-mixed joint compound being disposed in the interior space to a level which leaves a pre-determined head space, and an upper surface of the component is defined in the container. A second component is provided, including water, and is placed in the interior space upon the upper surface, such that the first and second components remain substantially distinct prior to opening of the container.
Public/Granted literature
- US20130161209A1 TWO-PHASE PACKAGING OF READY MIX JOINT COMPOUND Public/Granted day:2013-06-27
Information query
IPC分类: