Invention Grant
- Patent Title: Wireless IC device
- Patent Title (中): 无线IC设备
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Application No.: US12859880Application Date: 2010-08-20
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Publication No.: US08668151B2Publication Date: 2014-03-11
- Inventor: Noboru Kato , Satoshi Ishino
- Applicant: Noboru Kato , Satoshi Ishino
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-081310 20080326
- Main IPC: G06K19/06
- IPC: G06K19/06

Abstract:
A wireless IC device improves radiation characteristics or directivity of signals and reliably communicates with a reader/writer. The wireless IC device includes an electromagnetically coupled module includes a wireless IC device and a feed circuit substrate, a protective layer, a first radiation plate, and a second radiation plate. The feed circuit substrate includes a feed circuit including inductance elements. The feed circuit is electrically connected to the wireless IC chip and coupled to the radiation plates. Signals received by the radiation plates are provided to the wireless IC chip via the feed circuit. Signals from the wireless IC chip are provided to the radiation plates via the feed circuit and then radiated to the outside.
Public/Granted literature
- US20100314455A1 WIRELESS IC DEVICE Public/Granted day:2010-12-16
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