A vibration damping device adapted to receive an electronic component and reduce vibration is provided. The vibration damping device includes a spring body extending along an axis, one or more slots formed in the spring body, and a shaft extending substantially coaxially within the spring body. The shaft may include an internal bore configured to extend substantially coaxially through the spring body and shaft. The vibration damping device further includes a damping mechanism configured to be positioned between the spring body and the shaft, wherein the one or more slots provides flexible movement of the spring body and the damping mechanism provides the damping of motion within the internal bore.