Invention Grant
US08668191B2 Holding unit, assembly system, sputtering unit, and processing method and processing unit 有权
保持单元,组装系统,溅射单元,加工方法和处理单元

  • Patent Title: Holding unit, assembly system, sputtering unit, and processing method and processing unit
  • Patent Title (中): 保持单元,组装系统,溅射单元,加工方法和处理单元
  • Application No.: US13317994
    Application Date: 2011-11-02
  • Publication No.: US08668191B2
    Publication Date: 2014-03-11
  • Inventor: Yuichi Shibazaki
  • Applicant: Yuichi Shibazaki
  • Applicant Address: JP Tokyo
  • Assignee: Nikon Corporation
  • Current Assignee: Nikon Corporation
  • Current Assignee Address: JP Tokyo
  • Agency: Oliff PLC
  • Priority: JP2005-245439 20050826
  • Main IPC: B25B11/00
  • IPC: B25B11/00 H01L39/24
Holding unit, assembly system, sputtering unit, and processing method and processing unit
Abstract:
Because an electromagnetic chuck supplies current to a specific microcoil among a plurality of microcoils and makes an object exert an electromagnetic force working together with a magnet of the object, the object can be held in a state where the object is set at a desired position (a position that corresponds to the microcoil to which current has been supplied) on a base surface. Further, by gas that blows out from a gas supply passage, a levitation force is given to the object, which can reduce effects of a friction force that acts between the object and an upper surface of the electromagnetic chuck when the position of the object is set.
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