Invention Grant
US08668191B2 Holding unit, assembly system, sputtering unit, and processing method and processing unit
有权
保持单元,组装系统,溅射单元,加工方法和处理单元
- Patent Title: Holding unit, assembly system, sputtering unit, and processing method and processing unit
- Patent Title (中): 保持单元,组装系统,溅射单元,加工方法和处理单元
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Application No.: US13317994Application Date: 2011-11-02
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Publication No.: US08668191B2Publication Date: 2014-03-11
- Inventor: Yuichi Shibazaki
- Applicant: Yuichi Shibazaki
- Applicant Address: JP Tokyo
- Assignee: Nikon Corporation
- Current Assignee: Nikon Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2005-245439 20050826
- Main IPC: B25B11/00
- IPC: B25B11/00 ; H01L39/24

Abstract:
Because an electromagnetic chuck supplies current to a specific microcoil among a plurality of microcoils and makes an object exert an electromagnetic force working together with a magnet of the object, the object can be held in a state where the object is set at a desired position (a position that corresponds to the microcoil to which current has been supplied) on a base surface. Further, by gas that blows out from a gas supply passage, a levitation force is given to the object, which can reduce effects of a friction force that acts between the object and an upper surface of the electromagnetic chuck when the position of the object is set.
Public/Granted literature
- US20120055786A1 Holding unit, assembly system, sputtering unit, and processing method and processing unit Public/Granted day:2012-03-08
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