Invention Grant
- Patent Title: Damper mounting structure
- Patent Title (中): 减震器安装结构
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Application No.: US13822040Application Date: 2011-08-08
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Publication No.: US08668213B2Publication Date: 2014-03-11
- Inventor: Kazuki Takagi , Makoto Kihara , Masanori Hayashi , Noriaki Masuda
- Applicant: Kazuki Takagi , Makoto Kihara , Masanori Hayashi , Noriaki Masuda
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2010-206060 20100914
- International Application: PCT/JP2011/068038 WO 20110808
- International Announcement: WO2012/035907 WO 20120322
- Main IPC: B60G15/04
- IPC: B60G15/04 ; B60G15/06 ; F16F9/54 ; F16F1/373

Abstract:
A damper mounting structure is provided with a top buffer member and a bottom buffer member. The bottom buffer member has a protruding section that protrudes with an outer diameter smaller than the outer diameter of the bottom buffer member. The damper mounting structure mates with the protruding section and is anchored to a vehicle body panel, and is provided with a collar formed at substantially the same height as the height of the protruding section. The corner of an opening formed on the vehicle body panel, which comes into contact with the top buffer member, is chamfered.
Public/Granted literature
- US20130168941A1 DAMPER MOUNTING STRUCTURE Public/Granted day:2013-07-04
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