Invention Grant
- Patent Title: Integrated door scuff plate and wire shield
- Patent Title (中): 集成门刮板和电线屏蔽
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Application No.: US13494152Application Date: 2012-06-12
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Publication No.: US08668253B2Publication Date: 2014-03-11
- Inventor: William Bauer
- Applicant: William Bauer
- Applicant Address: US MI Dearborn
- Assignee: Ford Global Technologies, LLC
- Current Assignee: Ford Global Technologies, LLC
- Current Assignee Address: US MI Dearborn
- Agency: Price Heneveld LLP
- Agent Vichit Chea
- Main IPC: B60N3/00
- IPC: B60N3/00
Abstract:
A scuff plate assembly for use with an automotive vehicle door side sill includes an elongate scuff plate trim and a U-shaped wire shield for housing a wire harness. The scuff plate trim and wire shield are integrally coupled by a deformable living hinge that is disposed on an upper portion of the wire shield.
Public/Granted literature
- US20130328354A1 INTEGRATED DOOR SCUFF PLATE AND WIRE SHIELD Public/Granted day:2013-12-12
Information query
