Invention Grant
- Patent Title: Electronic device enclosure assembly
- Patent Title (中): 电子设备外壳组件
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Application No.: US13363440Application Date: 2012-02-01
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Publication No.: US08668283B2Publication Date: 2014-03-11
- Inventor: Chen-Lu Fan , Li-Ping Chen
- Applicant: Chen-Lu Fan , Li-Ping Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN201110058463 20110311
- Main IPC: A47B87/00
- IPC: A47B87/00

Abstract:
An electronic device enclosure assembly with a connecting assembly is disclosed. The electronic device enclosure assembly includes two electronic device enclosures. Each of the two electronic device enclosures includes a top frame, a bottom frame, a plurality of supports and a maintaining pole. The plurality of supports connects the top frame and the bottom frame, the maintaining pole is secured between two of the plurality of supports, and the maintaining pole defines a securing slot. A mounting member includes two side plates opposite to each other, and a positioning member protrudes from each of the two side plates. The maintaining poles of the two electronic device enclosures are located between the two side plates, the positioning member is engaged in the securing slot, and the two electronic device enclosures are connected together by the mounting member.
Public/Granted literature
- US20120229007A1 ELECTRONIC DEVICE ENCLOSURE ASSEMBLY Public/Granted day:2012-09-13
Information query