Invention Grant
- Patent Title: Light emitting module having heat conductive substrate
- Patent Title (中): 具有导热基板的发光模块
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Application No.: US13665227Application Date: 2012-10-31
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Publication No.: US08668355B2Publication Date: 2014-03-11
- Inventor: Takayoshi Moriyama , Kazunari Higuchi , Sumio Hashimoto , Shinichi Kumashiro
- Applicant: Toshiba Lighting & Technology Corporation
- Applicant Address: JP Yokosuka-shi, Kanagawa-ken JP Minato-ku, Tokyo
- Assignee: Toshiba Lightning & Technology Corporation,Kabushiki Kaisha Toshiba
- Current Assignee: Toshiba Lightning & Technology Corporation,Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Yokosuka-shi, Kanagawa-ken JP Minato-ku, Tokyo
- Agency: Banner & Witcoff, LTD.
- Priority: JP2008-142063 20080530; JP2009-071276 20090324
- Main IPC: F21S4/00
- IPC: F21S4/00 ; H05K1/05

Abstract:
A substrate having a plurality of light-emitting elements mounted thereon is described. The substrate may be mounted in a lighting apparatus and may include a surface on which the plurality of light-emitting elements are mounted and one or more holes through which heat may be conducted from the first surface to another surface of the substrate. For example, a heat conductive and electrically non-conductive material may cover a surface of the one or more holes. According to some arrangements, the surface of the substrate may include an electrically non-conductive layer and an electrically conductive layer such that the electrically non-conductive layer is electrically isolated or separated from the electrically conductive layer.
Public/Granted literature
- US20130058109A1 Lighting Apparatus and Light-Emitting Element Substrate Having Stress Absorbing Means Public/Granted day:2013-03-07
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