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US08668484B2 Mold, imprint method, and process for producing a chip 有权
模具,压印方法和制造芯片的工艺

Mold, imprint method, and process for producing a chip
Abstract:
A mold capable of a highly accurate alignment with a member to be processed in such a state that a photocurable resin material is disposed between the mold and the member to be processed, and is constituted by a substrate 2010 formed of a first material and an alignment mark 2102 formed of a second material different from the first material. The first material and the second material have transmissivities to light in a part of an ultraviolet wavelength range. The second material has a refractive index of not less than 1.7.
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