Invention Grant
- Patent Title: Electronic module with improved latch mechanism
- Patent Title (中): 具有改进的闩锁机构的电子模块
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Application No.: US13349899Application Date: 2012-01-13
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Publication No.: US08668515B2Publication Date: 2014-03-11
- Inventor: Jerry Wu
- Applicant: Jerry Wu
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agent Wei Te Chung; Ming Chieh Chang
- Priority: CN201110024055 20110121
- Main IPC: H01R13/627
- IPC: H01R13/627

Abstract:
An electronic module (100) for mating with a complementary connector, comprises: a housing defining a recess area and a printed circuit board (3) disposed in the housing. A slider member is (61) assembled to an exterior surface of the housing and defining a pair of arm portions (612) formed on a front end thereof. And a gasket (5) is assembled to the recess area and defining a pair of curved portions (543) located above two free ends of the pair of arm portions. Whereby movement of the slider by a user along a front to rear direction, the two free ends of the pair of arm portions respectively raise up the pair of curved portions.
Public/Granted literature
- US20120190224A1 ELECTRONIC MODULE WITH IMPROVED LATCH MECHANISM Public/Granted day:2012-07-26
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