Invention Grant
- Patent Title: Split jack assemblies and methods for making the same
- Patent Title (中): 分体插座组件及其制作方法
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Application No.: US13631553Application Date: 2012-09-28
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Publication No.: US08668528B2Publication Date: 2014-03-11
- Inventor: Fletcher R. Rothkopf , Anna-Katrina Shedletsky , Ian P. Colahan , Daniele De Iuliis , Trent K. Do
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: H01R24/04
- IPC: H01R24/04

Abstract:
Split jack assemblies are constructed with a tubeless pin block. Elimination (or split) of the tube, or more particularly, a tube that is an integrally formed part of the pin block form the pin block allows for the use of a tubeless pin block design that results in a jack assembly having smaller overall dimensions than a conventional jack assembly constructed to accommodate a plug of the same dimensions. The tubeless pin block can be used in conjunction with a tube sleeve or with a curved surface of a housing for an electronic device, or both to provide a plug receptacle of the split jack assembly.
Public/Granted literature
- US20130109248A1 SPLIT JACK ASSEMBLIES AND METHODS FOR MAKING THE SAME Public/Granted day:2013-05-02
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