Invention Grant
- Patent Title: Contact terminal
- Patent Title (中): 接线端子
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Application No.: US13405582Application Date: 2012-02-27
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Publication No.: US08668529B2Publication Date: 2014-03-11
- Inventor: Je-Min Park , Sung-Jun Hwang
- Applicant: Je-Min Park , Sung-Jun Hwang
- Applicant Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Yeongtong-gu, Suwon-si, Gyeonggi-do
- Agency: Cha & Reiter, LLC
- Priority: KR10-2011-0077321 20110803
- Main IPC: H01R13/24
- IPC: H01R13/24
Abstract:
A contact terminal includes: a contact pin; and a plate spring configured to support the contact pin, wherein a portion of the plate spring is connected to a circuit board, wherein the contact pin can be connected to a counterpart while being supported by the plate spring, thus ensuring a stable connection structure.
Public/Granted literature
- US20130035006A1 CONTACT TERMINAL Public/Granted day:2013-02-07
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