The invention provides a method of manufacturing a relief printing plate having at least engraving an area which is in a relief forming layer of a relief printing plate precursor for laser engraving and is to be exposed by scanning exposure using a fiber-coupled semiconductor laser which emits laser beam with a wavelength of 700 nm to 1,300 nm. The relief printing plate precursor has at least a relief forming layer provided over a support, and the relief forming layer contains at least a binder polymer and a photo-thermal conversion agent. The invention further provides a relief printing plate precursor for laser engraving which can be used in the method of manufacturing a relief printing plate.