Invention Grant
- Patent Title: Method of and device for determining and controlling the distance between an integrated circuit and a substrate
- Patent Title (中): 用于确定和控制集成电路与衬底之间的距离的方法和装置
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Application No.: US12745465Application Date: 2008-11-25
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Publication No.: US08669123B2Publication Date: 2014-03-11
- Inventor: Christian Zenz
- Applicant: Christian Zenz
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP07121879 20071129; EP07122903 20071211
- International Application: PCT/IB2008/054944 WO 20081125
- International Announcement: WO2009/069075 WO 20090604
- Main IPC: H01L21/00
- IPC: H01L21/00 ; G01B11/06

Abstract:
In a method of determining the distance (d) between an integrated circuit (1) and a substrate (2) emitted light enters the at least semi transparent substrate (2), passes through the substrate (2) and an at least semi transparent material (8), is reflected by the integrated circuit (1), passes again through the material (8) and the substrate (2), and leaves the substrate (2). The at least semi transparent material (8), particularly is an at least semi transparent adhesive, provided between the substrate (2) and the integrated circuit (1). The distance (d) between the substrate (2) and the integrated circuit (1) is determined by evaluating the intensities of the light leaving and entering the substrate (2), particularly by evaluating the ratio between the intensities of the light leaving and entering the substrate (2).
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