Integrating a first contact structure in a gate last process

Invention Grant

US08669153B2 Integrating a first contact structure in a gate last process 有权

Title translation: 在最后一个进程中集成第一个接触结构

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Patent Title: Integrating a first contact structure in a gate last process
Patent Title (中): 在最后一个进程中集成第一个接触结构
Application No.: US13794621

Application Date: 2013-03-11
Publication No.: US08669153B2

Publication Date: 2014-03-11
Inventor: Chiung-Han Yeh , Ming-Yuan Wu , Kong-Beng Thei , Harry Chuang , Mong-Song Liang
Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
Applicant Address: TW Hsin-Chu
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
Current Assignee Address: TW Hsin-Chu
Agency: Haynes and Boone, LLP
Main IPC: H01L21/8238
IPC: H01L21/8238

Integrating a first contact structure in a gate last process

Abstract:

A method is provided that includes providing a substrate; forming a transistor in the substrate, the transistor having a dummy gate; forming a dielectric layer over the substrate and transistor; forming a contact feature in the dielectric layer; and after forming the contact feature, replacing the dummy gate of the transistor with a metal gate. An exemplary contact feature is a dual contact.

Abstract(Chinese):

提供了一种提供基板的方法，在衬底中形成晶体管，晶体管具有虚拟栅极; 在衬底和晶体管上形成介电层; 在介电层中形成接触特征; 并且在形成接触特征之后，用金属栅极替换晶体管的虚拟栅极。示例性接触特征是双重接触。

Public/Granted literature

US20130196496A1 Integrating a First Contact Structure in a Gate Last Process Public/Granted day:2013-08-01

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS