Method of manufacturing nonvolatile semiconductor device

Invention Grant

US08669172B2 Method of manufacturing nonvolatile semiconductor device 有权

Title translation: 非易失性半导体器件的制造方法

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Patent Title: Method of manufacturing nonvolatile semiconductor device
Patent Title (中): 非易失性半导体器件的制造方法
Application No.: US13488015

Application Date: 2012-06-04
Publication No.: US08669172B2

Publication Date: 2014-03-11
Inventor: Yasuaki Yonemochi , Hisakazu Otoi , Akio Nishida , Shigeru Shiratake
Applicant: Yasuaki Yonemochi , Hisakazu Otoi , Akio Nishida , Shigeru Shiratake
Applicant Address: JP Kanagawa
Assignee: Renesas Electronics Corporation
Current Assignee: Renesas Electronics Corporation
Current Assignee Address: JP Kanagawa
Agency: McDermott Will & Emery LLP
Priority: JP2005-118505 20050415
Main IPC: H01L21/3205
IPC: H01L21/3205 ; H01L21/4763

Method of manufacturing nonvolatile semiconductor device

Abstract:

A semiconductor substrate having a main surface, first and second floating gates formed spaced apart from each other on the main surface of the semiconductor substrate, first and second control gates respectively located on the first and second floating gates, a first insulation film formed on the first control gate, a second insulation film formed on the second control gate to contact the first insulation film, and a gap portion formed at least between the first floating gate and the second floating gate by achieving contact between the first insulation film and the second insulation film are included. With this, a function of a nonvolatile semiconductor device can be ensured and a variation in a threshold voltage of a floating gate can be suppressed.

Abstract(Chinese):

一种具有主表面的半导体衬底，在半导体衬底的主表面上彼此隔开形成的第一和第二浮置栅极，分别位于第一和第二浮置栅极上的第一和第二控制栅极，形成在第一和第二浮置栅极上的第一绝缘膜第一控制栅极，形成在第二控制栅极上以与第一绝缘膜接触的第二绝缘膜，以及通过实现第一绝缘膜和第二绝缘体之间的接触而形成在至少在第一浮栅和第二浮栅之间的间隙部分包括电影。由此，可以确保非易失性半导体器件的功能，并且可以抑制浮动栅极的阈值电压的变化。

Public/Granted literature

US20120238089A1 METHOD OF MANUFACTURING NONVOLATILE SEMICONDUCTOR DEVICE Public/Granted day:2012-09-20

Information query

Espacenet

IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/18	...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体，如掺杂材料
H01L21/30	....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/28）
H01L21/31	.....在半导体材料上形成绝缘层的，例如用于掩膜的或应用光刻技术的（密封层入H01L21/56）；以及这些层的后处理；这些层的材料的选择
H01L21/3205	......非绝缘层的沉积，例如绝缘层上的导电层或电阻层；这些层的后处理（电极的制造入H01L21/28）