Invention Grant
US08669513B2 Method of assembling a light sensor module using an intermediate layer, and light sensor module assembly including the same
有权
使用中间层组装光传感器模块的方法和包括该光传感器模块组件的光传感器模块组件
- Patent Title: Method of assembling a light sensor module using an intermediate layer, and light sensor module assembly including the same
- Patent Title (中): 使用中间层组装光传感器模块的方法和包括该光传感器模块组件的光传感器模块组件
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Application No.: US12447722Application Date: 2007-10-29
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Publication No.: US08669513B2Publication Date: 2014-03-11
- Inventor: Patrick J. Hughes , John C. Jackson
- Applicant: Patrick J. Hughes , John C. Jackson
- Applicant Address: IE Cork
- Assignee: SensL Technologies Limited
- Current Assignee: SensL Technologies Limited
- Current Assignee Address: IE Cork
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: GB0621495.1 20061030
- International Application: PCT/EP2007/061619 WO 20071029
- International Announcement: WO2008/052965 WO 20080508
- Main IPC: H01J3/14
- IPC: H01J3/14 ; G01T1/20

Abstract:
A method is provided of at least partly assembling a light sensor module having at least one light sensing element optically coupled to a further optical element, for receiving light therefrom. The method comprises coupling the at least one light sensing element to an intermediate layer, wherein the intermediate layer is adapted to provide at least a predetermined level of optical coupling between the optical element and the at least one light sensing element when assembled by subsequently coupling, for example as part of a separate method, the intermediate layer to the optical element, with the intermediate layer being arranged between the optical element and the at least one light sensing element. An optical element other than a light sensing element, for example a light source element, can be used in place of the or each light sensing element, with in that case the or each optical element providing light to the further optical element rather than receiving light therefrom. Thus, the method can relate to an optical assembly in general rather than to a light sensor module assembly in particular.
Public/Granted literature
- US20100065724A1 METHOD OF ASSEMBLING A LIGHT ELEMENT MODULE AND LIGHT ELEMENT MODULE ASSEMBLY Public/Granted day:2010-03-18
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