Invention Grant
US08669580B2 Scalable heat dissipating microelectronic integration platform (SHDMIP) for lighting solutions and method of manufacturing thereof
失效
用于照明解决方案的可扩展散热微电子集成平台（SHDMIP）及其制造方法
- Patent Title: Scalable heat dissipating microelectronic integration platform (SHDMIP) for lighting solutions and method of manufacturing thereof
- Patent Title (中): 用于照明解决方案的可扩展散热微电子集成平台（SHDMIP）及其制造方法
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Application No.: US13288979Application Date: 2011-11-04
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Publication No.: US08669580B2Publication Date: 2014-03-11
- Inventor: Thomas Joachim Werner Morsheim , Fernando Villon Capinig , Dandy Navarro Jaducana , Anthony Augusto Malon Galay
- Applicant: Thomas Joachim Werner Morsheim , Fernando Villon Capinig , Dandy Navarro Jaducana , Anthony Augusto Malon Galay
- Applicant Address: PH Metro Manila
- Assignee: PSI Technologies, Inc.
- Current Assignee: PSI Technologies, Inc.
- Current Assignee Address: PH Metro Manila
- Agency: Pyprus Pte Ltd
- Main IPC: H01J7/44
- IPC: H01J7/44 ; H01J7/24
Abstract:
The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.
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