Invention Grant
US08669622B2 Non-volatile semiconductor devices and methods of manufacturing non-volatile semiconductor devices
有权
非挥发性半导体器件和制造非易失性半导体器件的方法
- Patent Title: Non-volatile semiconductor devices and methods of manufacturing non-volatile semiconductor devices
- Patent Title (中): 非挥发性半导体器件和制造非易失性半导体器件的方法
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Application No.: US13157753Application Date: 2011-06-10
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Publication No.: US08669622B2Publication Date: 2014-03-11
- Inventor: Hak-Sun Lee , Kyoung-Sub Shin
- Applicant: Hak-Sun Lee , Kyoung-Sub Shin
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2008-0109452 20081105
- Main IPC: H01L21/70
- IPC: H01L21/70

Abstract:
A non-volatile semiconductor device includes a memory cell in a first area of a substrate, a low voltage transistor in a second area of the substrate, and a high voltage transistor in a third area of the substrate. The memory cell includes a tunnel insulation layer formed on the substrate, a charge trapping layer pattern formed on the tunnel insulation layer in the first area of the substrate, a blocking layer pattern formed on the charge trapping layer pattern and a control gate formed on the blocking layer pattern. The control gate has a width substantially smaller than a width of the blocking layer pattern and the width of the control gate is substantially smaller than a width of the charge trapping layer pattern. In addition, an offset is formed between the control gate and the blocking layer pattern such that a spacer is not formed on a sidewall of the control gate.
Public/Granted literature
- US20110233653A1 NON-VOLATILE SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING NON-VOLATILE SEMICONDUCTOR DEVICES Public/Granted day:2011-09-29
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