Invention Grant
- Patent Title: Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor
- Patent Title (中): 具有电子部件的半导体装置，电子装置以及半导体的制造方法
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Application No.: US12730455Application Date: 2010-03-24
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Publication No.: US08669653B2Publication Date: 2014-03-11
- Inventor: Kiyoshi Oi
- Applicant: Kiyoshi Oi
- Applicant Address: JP Nagano-shi, Nagano
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi, Nagano
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2009-077033 20090326
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L23/488 ; H01L21/50
Abstract:
A semiconductor device includes: a wiring board which includes a first face and a second face and in which a conductor pattern and a through part are provided; an electronic component which includes an electrode pad forming face where an electrode pad is formed and which is housed in the through part so that the electrode pad forming face is provided on the first face side; a seal resin which is provided in the through part and the electrode pad forming face, seals the electronic component and includes a first plane exposing a connection face of the electrode pad; and a wiring pattern which is provided in the first face of the wiring board and the first plane of the seal resin and electrically connects the connection face of the electrode pad with a first connected face of the conductor pattern, and which includes a pad part.
Public/Granted literature
- US20100244230A1 SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE Public/Granted day:2010-09-30
Information query
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