Invention Grant
- Patent Title: Multi-layer electronic component and method for manufacturing the same
- Patent Title (中): 多层电子元件及其制造方法
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Application No.: US12095484Application Date: 2006-11-28
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Publication No.: US08669694B2Publication Date: 2014-03-11
- Inventor: Masahiro Sato
- Applicant: Masahiro Sato
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2005-343492 20051129; JP2006-292384 20061027
- International Application: PCT/JP2006/323715 WO 20061128
- International Announcement: WO2007/063850 WO 20070607
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
A multi-layer electronic component that can be repetitively operated under high voltage, high temperature and high humidity is provided.The multi-layer electronic component comprises a plurality of dielectric material layers made of a sintered material having perovskite structure that includes Pb; and a plurality of internal electrodes, the dielectric material layers and the internal electrodes being stacked alternately one on another, wherein lead compound that remains in the crystal grain boundaries of the dielectric material layers is controlled so that the number of grains of the lead compound not smaller than 0.01 μm are 2 or less per 100 μm2 on average.
Public/Granted literature
- US20100006678A1 Multi-Layer Electronic Component and Method for Manufacturing the Same Public/Granted day:2010-01-14
Information query
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