Invention Grant
- Patent Title: Electronic component package sealing member, electronic component package, and method for manufacturing electronic component package sealing member
- Patent Title (中): 电子部件封装部件，电子部件封装以及电子部件封装部件的制造方法
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Application No.: US13266945Application Date: 2011-03-04
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Publication No.: US08669819B2Publication Date: 2014-03-11
- Inventor: Naoki Kohda
- Applicant: Naoki Kohda
- Applicant Address: JP Kakogawa-shi
- Assignee: Daishinku Corporation
- Current Assignee: Daishinku Corporation
- Current Assignee Address: JP Kakogawa-shi
- Agency: Mots Law, PLLC
- Agent Marvin A. Motsenbocker
- Priority: JP2010-048099 20100304
- International Application: PCT/JP2011/055106 WO 20110304
- International Announcement: WO2011/108715 WO 20110909
- Main IPC: H03B1/00
- IPC: H03B1/00
Abstract:
An electronic component package sealing member that can be used as a first sealing member in an electronic component package in which an electrode of an electronic component element is hermetically sealed with the first sealing member and a second sealing member arranged so as to oppose each other, includes: a through hole that passes through a substrate of the electronic component package sealing member; an internal electrode that is formed on a face of the substrate opposing the second sealing member; an external electrode that is formed on a face of the substrate opposite the opposing face; and a through electrode that is formed on an inner side face of the through hole electrically connecting the internal electrode and the external electrode. In the electronic component package sealing member, at least one open face of the through hole is sealed with a resin material.
Public/Granted literature
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