Invention Grant
- Patent Title: Dual-band antenna and related wireless communication apparatus
- Patent Title (中): 双频天线及相关无线通讯设备
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Application No.: US13096436Application Date: 2011-04-28
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Publication No.: US08669914B2Publication Date: 2014-03-11
- Inventor: Bo Pan , Ching-Wei Ling
- Applicant: Bo Pan , Ching-Wei Ling
- Applicant Address: TW Hsinchu
- Assignee: Realtek Semiconductor Corp.
- Current Assignee: Realtek Semiconductor Corp.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01Q11/00
- IPC: H01Q11/00

Abstract:
A dual-band antenna is disclosed including: a first antenna comprising: a first radiating portion including a plurality of separated radiating strips positioned on a first plane of a circuit board; a second radiating portion including a plurality of separated radiating strips positioned on a second plane of the circuit board; and a plurality of vias for coupling the plurality of radiating strips on the first plane with the plurality of radiating strips on the second plane to form a spiral radiating body; a second antenna having a radiating plane coupled with the first radiating portion or the second radiating portion; a shorting element coupled with the radiating plane and shared by the first and second antennas; and a feeding element coupled with the radiating plane and shared by the first and second antennas; wherein the width of part of the radiating plane gradually increases along a direction.
Public/Granted literature
- US20120274534A1 DUAL-BAND ANTENNA AND RELATED WIRELESS COMMUNICATION APPARATUS Public/Granted day:2012-11-01
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