Invention Grant
- Patent Title: Solid-state imaging device, manufacturing method of solid-state imaging device and electronic apparatus
- Patent Title (中): 固态成像装置，固态成像装置和电子装置的制造方法
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Application No.: US13974390Application Date: 2013-08-23
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Publication No.: US08670053B2Publication Date: 2014-03-11
- Inventor: Yoshimichi Kumagai , Hiroaki Ishiwata
- Applicant: Sony Corporation
- Applicant Address: JP
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Priority: JPP2009-050132 20090304
- Main IPC: H04N5/335
- IPC: H04N5/335
Abstract:
A solid-state imaging device, includes: plural unit pixels including a photoelectric conversion portion converting incident light into an electrical signal, and a waveguide having a quadratic curve surface at an inner surface and introducing the incident light to the photoelectric conversion portion.
Public/Granted literature
- US20130341748A1 SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2013-12-26
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