Invention Grant
- Patent Title: Handle module and electronic device having the handle module
- Patent Title (中): 手柄模块和具有手柄模块的电子设备
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Application No.: US13113781Application Date: 2011-05-23
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Publication No.: US08670233B2Publication Date: 2014-03-11
- Inventor: Min-Hsiung Huang , Ming-Jen Tsai , Jung-Shu Hsiao
- Applicant: Min-Hsiung Huang , Ming-Jen Tsai , Jung-Shu Hsiao
- Applicant Address: TW New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW New Taipei
- Agency: Merchant & Gould P.C.
- Priority: TW99120615A 20100624
- Main IPC: B25G1/04
- IPC: B25G1/04 ; G06F1/16 ; H05K5/00 ; H05K7/00

Abstract:
A handle module mounted in a case of an electronic device and including a handle-link assembly and a slide mechanism. The handle-link assembly includes a handle body having a gripping section and a first pivot connection portion formed thereon, and a slide link having a link body unit and a second pivot connection portion formed thereon. The second pivot connection portion is pivotable with the first pivot connection portion. The slide mechanism includes a slide groove unit disposed in the link body unit or the case, and a slide axle unit disposed slidably in the link body unit or the case, and that is slidably extended into the slide groove unit. The handle-link assembly may be moved between a folded state, where the slide link is received in the case, and an unfolded state, where the slide link is extended out of the case.
Public/Granted literature
- US20110317345A1 HANDLE MODULE AND ELECTRONIC DEVICE HAVING THE HANDLE MODULE Public/Granted day:2011-12-29
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