A heat-release configuration includes a printed board on which a semiconductor component is mounted, a heat-release plate which is mounted on the semiconductor component, and configured to diffuse heat generated by the semiconductor component; and a supporting clamp which is mounted on the heat-release plate, and configured to fix the heat-release plate to the printed board via a hole provided in the printed board, the supporting clamp including a sectional L-shape in a horizontal direction having two flat surfaces substantially orthogonal to each other, the supporting clamp having on a lower side of each of the flat surfaces a leading end portion which is inserted into the hole of the printed board and a locking claw which is formed in the leading end portion and projects outside the L-shape.