Invention Grant
US08670641B2 Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
有权
光束均化器,激光照射装置以及半导体装置的制造方法
- Patent Title: Beam homogenizer, laser irradiation apparatus, and method for manufacturing semiconductor device
- Patent Title (中): 光束均化器,激光照射装置以及半导体装置的制造方法
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Application No.: US13688911Application Date: 2012-11-29
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Publication No.: US08670641B2Publication Date: 2014-03-11
- Inventor: Koichiro Tanaka , Hirotada Oishi
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2004-290968 20041004
- Main IPC: G02B6/12
- IPC: G02B6/12

Abstract:
The present invention is to provide a beam homogenizer, a laser irradiation apparatus, and a method for manufacturing a semiconductor device, which can suppress the loss of a laser beam and form a beam spot having homogeneous energy distribution constantly on an irradiation surface without being affected by beam parameters of a laser beam. A deflector is provided at an entrance of an optical waveguide or a light pipe used for homogenizing a laser beam emitted from a laser oscillator. A pair of reflection planes of the deflector is provided so as to have a tilt angle to an optical axis of the laser beam, whereby the entrance of the optical waveguide or the light pipe is expanded. Accordingly, the loss of the laser beam can be suppressed. Moreover, by providing an angle adjusting mechanism to the deflector, a beam spot having homogeneous energy distribution can be formed at an exit of the optical waveguide.
Public/Granted literature
- US20130084691A1 BEAM HOMOGENIZER, LASER IRRADIATION APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2013-04-04
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